Home › Chemicals › Epoxy Resin (Bisphenol A Diglycidyl Ether) CAS 25068-38-6: Epoxy Resin (Bisphenol A Diglycidyl Ether) (C21H24O4) Identity CAS Number 25068-38-6 Molecular Formula C21H24O4 IUPAC Name 2-[[4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Molecular Weight 340.42 g/mol SMILES CC(Cc1ccc(OCC2CO2)cc1)c1ccc(OCC2CO2)cc1Synonyms DGEBA, bisphenol A diglycidyl ether, BADGE, EPN
2D Structure
Physical Properties Density 1.17 g/mL at 25°C Boiling Point 250.0°C Melting Point -17.0°C Flash Point 250.0°C Vapor Pressure 0.0 kPa at 20°C Refractive Index nD = 1.572 Dielectric Constant ε = 3.9
Safety & GHS Classification GHS05 Irritant
H315: Causes skin irritation H317: May cause an allergic skin reaction H319: Causes serious eye irritation H335: May cause respiratory irritation H412: Harmful to aquatic life with long lasting effects Storage: Store in cool, dry place. Skin sensitizer — avoid repeated contact. Uncured resin is sticky and difficult to remove. Keep away from amines (curing agents) until ready to use.
Material Compatibility Matrix Plastics Material Rating PTFE Excellent PVC Good PE Good PP Good PEEK Excellent PVDF Good
Rubbers Material Rating Viton Good NBR Good EPDM Good Silicone Good FKM Good
Metals Material Rating Stainless 316 Excellent Aluminum Excellent Copper Excellent Brass Excellent
Applications Protective coatings and paints (50% of demand) Electrical insulation and PCB laminates Adhesive manufacturing Composite materials (aerospace, automotive) Flooring and construction Marine coatings Tooling and casting resins External References: PubChem
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